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copper pasteの例文

例文

  1. Microvias can be filled with different materials and processes : ( 1 ) filled with epoxy resin ( b-stage ) during a sequential lamination process step; ( 2 ) filled with non-conductive or conductive material other than copper as a separate processing step; ( 3 ) plated closed with electroplated copper; ( 4 ) screen printed closed with a copper paste.

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